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DAC8413BTC/883C 西安通信IC 鸿科伟业现货

鴻科偉業集團有限公司
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DAC8413BTC/883C 

产品详情

DAC8412/DAC8413均为四通道、12位电压输出DAC,具有回读功能。这些单芯片DAC采用互补BiCMOS工艺制造,可提供非常高的封装密度。


输出电压摆幅由两个基准电压输入VREFH 和VREFL设置。将 VREFL输入设置为0 V且 VREFH设置为正电压时,DAC提供单极性正输出范围。采用类似的配置,即 VREFH 为0 V且 VREFL为负电压时,DAC可提供单极性负输出范围。双极性输出通过VREFH 和 VREFL 均与非零电压相连来配置。这种设置输出电压范围的方法不依赖于温度系数不同的内部与外部电阻,因此优于其他双极性偏移法。

数字控制允许用户加载或回读任意DAC的数据,加载任意DAC,以及将数据一次传输给所有DAC。

低电平有效的RESET 将所有DAC输出寄存器加载至中量程(DAC8412)或零电平(DAC8413)。

DAC8412/DAC8413采用28引脚塑料DIP封装、28引脚陶瓷DIP封装、28引脚PLCC封装,以及28引脚LCC封装。

这些器件可以采用各种电源和基准电压工作,电源电压范围为+5 V至±15 V,基准电压范围为+2.5 V至±10 V。采用±15 V电源供电时,功耗低于330 mW;采用+5 V电源供电时,功耗仅为60 mW。

于MIL-STD-883应用,请联系当地的ADI办事处以获取DAC8412/DAC8413/883数据手册,其额定工作温度范围为−55°C至+125°C。所有883器件同时提供符合标准军用图纸5962-91 76401MXA至76404M3A的引脚分布。

应用

  • 自动测试设备

  • 数字控制校准

  • 伺服控制器

  • 过程控制设备



SMJ320C25FDM

This data sheet provides design documentation for the SMJ320C25 and the SMJ320C25-50 digital signal processor (DSP) devices in the SMJ320 family of VLSI digital signal processors and peripherals. The SMJ320 family supports a wide range of digital signal processing applications such as tactical communications, guidance, military modems, speech processing, spectrum analysis, audio processing, digital filtering, high-speed control, graphics, and other computation-intensive applications.

Differences between the SMJ320C25 and the SMJ320C25-50 are specifically identified, as in the following paragraph and in the parameter tables on pages 18 through 24 of this data sheet. When not specifically differentiated, the term SMJ320C25 is used to describe both devices.

The SMJ320C25 has a 100-ns instruction cycle time. The SMJ320C25-50 has an 80-ns instruction cycle time. With these fast instruction cycle times and their innovative memory configurations, these devices perform operations necessary for many real-time digital signal processing algorithms. Since most instructions require only one cycle, the SMJ320C25 is capable of executing 12.5 million instructions per second. On-chip data RAM of 544 16-bit words, on-chip program ROM of 4K words, direct addressing of up to 64K words of external data memory space and 64K words of external program memory space, and multiprocessor interface features for sharing global memory minimize unnecessary data transfers to take full advantage of the capabilities of the instruction set.


Key Features

  • Military Temperature Range

    • -55°C to 125°C

  • 100-ns or 80-ns Instruction Cycle Times

  • 544 Words of Programmable On-Chip Data RAM

  • 4K Words of On-Chip Program ROM

  • 128K Words of Data/Program Space

  • 16 Input and 16 Output Channels

  • 16-Bit Parallel Interface

  • Directly Accessible External Data Memory Space

    • Global Data Memory Interface

  • 16-Bit Instruction and Data Words

  • 16 × 16-Bit Multiplier With a 32-Bit Product

  • 32-Bit ALU and Accumulator

  • Single-Cycle Multiply/Accumulate Instructions

  • 0 to 16-Bit Scaling Shifter

  • Bit Manipulation and Logical Instructions

  • Instruction Set Support for Floating-Point Operations, Adaptive Filtering, and Extended-Precision Arithmetic

  • Block Moves for Data/Program Management

  • Repeat Instructions for Efficient Use of Program Space

  • Eight Auxiliary Registers and Dedicated Arithmetic Unit for Indirect Addressing

  • Serial Port for Direct Code Interface

  • Synchronization Input for Synchronous Multiprocessor Configurations

  • Wait States for Communication to Slow-Off-Chip Memories/Peripherals

  • On-Chip Timer for Control Operations

  • Three External Maskable User Interrupts

  • Input Pin Polled by Software Branch Instruction

  • 1.6-um CMOS Technology

  • Programmable Output Pin for Signaling External Devices

  • Single 5-V Supply

  • On-Chip Clock Generator

  • Packaging:

    • 68-Pin Leaded Ceramic Chip Carrier (FJ Suffix)

    • 68-Pin Ceramic Grid Array (GB Suffix)

    • 68-Pin Leadless Ceramic Chip Carrier (FD Suffix)



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